18
Batch Fabrication Technology
• Planar integrated circuit technology 1958 -
1. Thin-film deposition and etching
2. Modification of the top few μm of the substrate
3. Lateral dimensions defined by photolithography, a
process derived from offset printing
• Result: CMOS integrated circuits became the
ultimate “enabling technology” by circa 1980
• Moore’s Law
Density (and performance, broadly defined) of digital
integrated circuits increases by a factor of two
every year.