The present smart phone market demands high clock CPU, high resolution displays, and high speed connectivity. These requirements necessitate large power consumption. Therefore, it is very important to use efficiently the limited battery energy [1]. This is why a switch mode power supply (SMPS) is used for the high-current voltage rails in smart phone power systems. Particularly, a boost convertor is used for the display power system because the bias voltage of the display panel is higher than the cell voltage of the Li-ion battery in most cases. For example, the output voltage value of the boost convertor used for the display panel bias is around 5 V, which is close to the absolute maximum rated (AMR) voltage of the boost convertor itself. In the case of a boost convertor, the switching node voltage becomes the same as the output voltage during on duty of high side MOSFET. Therefore, it is more likely to exceed AMR voltage at the switch node in the boost convertor. Moreover, as the high efficiency of the SMPS is being emphasized, the MOSFET’s turn on and turns off speed is getting faster than before in order to reduce the switching loss. As a result, the MOSFET of the SMPS experiences substantial voltage stress such as voltage overshoot and voltage ringing. It is very important to keep the voltage stress below the AMR voltage to prevent MOSFET breakdown. This paper describes a method for reducing the voltage stress over the internal MOSFET of a boost convertor on the printed circuit board (PCB) level.