A simple chip-to-ch
hesive bonded ribbons
loss problem of wire
millimeterwave assemblies.
design and fabrication
static model is developed
their electrical behavior.
on microstrip resonators
The chip-to-chip inter
bonded ribbons exhibit
GHz or more.
Abstract
p interconnect technique with ad-
is presented. It solves the insertion
hond interconnects in micro- and
The following paper discusses
of such interconnects. A quasi -
to ease the quality assessment of
It is validated by measurements
with and without interconnects.
sonnect technique with adhesive
low loss and is useable up to 50