The deposition ambient played an important role in the films thickness. Increasing the CH4 content in the deposition chamber from 0 to 1 mbar increased the films’ thickness, due to plasma confinement which directed the ablated material towards the substrate. At 10 mbar CH4, the deposition rate was dramatically decreased by more than 95%, probably due to numerous collisions between ablated species and the CH4 molecules, resulting in a slowing down and even complete stop of the species on their track towards the substrate.