With the same method, users can incorporate sensors near the gate to monitor the changes of shear stress. During filling stage, the stress rises sharply at around 0.25 second and keeps increasing due to high volume of melt material is pushed through the gate. The stress drops sharply at the beginning of packing stage but there is slightly increase in pressure after 10.75 second (as shown in the right panel). The presence of the residual stress due to polymer is under re-organizing process when melt material starts to freeze during packing stage. By examining X-Y curve, users can further realize the molding behavior and monitor for either normal or abnormal changes.