Using laser direct writing in combination with chemical vapor
deposition to produce nanometer scale electronics holds several advantages
over current large scale photolithography methods. These include
single step electrical interconnect deposition, mask-less patterning, and
parallel processing. When taken together they make quick production
of individualized electronic circuits possible. This work demonstrates the
ability of combining laser direct write and chemical vapor deposition to produce
silicon wires a few hundred nanometers wide. Optimized parameters
will be discussed, with a particular emphasis paid to the laser-material
interactions. The feasibility for electronic applications will be shown by
examining the deposition formation on a silicon dioxide surface without
degrading the surface’s integrity, and by evaluating the resistivity of the
deposited silicon wires.