Tag components are packaged in various ways to make them easy to handle for
tag manufacturers with different levels of expertise in manipulating small electronic
components. The manufacturing of the final tags from the various components
require organizations with expertise in semiconductor design and
manufacturing, RF devices design,manufacturing of printed circuits, and manufacturing
and printing of labels. Because of this complexity, tag components
are packaged into subassemblies that make tags easier to manufacture. Three
commonly used terms in tag manufacturing are strap, inlay, and smart label