"(5) There is a mechanism to periodically analyze or replace plating solution (including solder dip tanks).
As the concentration of lead containing solder in plating solution and solder dip tanks changes, plating solution and solder replacement and component analyses should be implemented as rules. A mechanism for periodically implementing component analyses (Cd, Pb, Hg, Cr+6).
- With solder mini-dips, solder can be periodically replaced without periodic analyses.
- The timing for component analyses and replacement should be determined by a mechanism based on back data.
- A mechanism to conduct periodic cleanings of the plating solution tank.
"(6) Plating solution (including solder dip tanks) is used in accordance with a mechanism of periodic analyses or replacement.
- Actual implementation records are checked, and operation is in accordance with the rules. "