We have presented the system architecture to allow for low power and low cost ultrasonic NDT using WSNs.
Our NDT solution is developed as a modular architecture with PnP capabilities provided by our previous work on
Sprouts. The NDT-module was used to measures the thickness of the steel and tungsten layers in a compound metal
structure. We have shown analytical and experimental analysis to verify our working solution. Our application
results show that for thickness based measurements, accuracy of measurements using low power sensor nodes, such
as MSP430 MCUs, can be as high as 99.69% for a steel bar of 19.5mm thickness. This introduces a new promising
application domain in using ultra low power MCUs in WSN nodes for NDT-based measurements applicable in
industrial, scientific, or commercial domains, where equipment, material, or structures can be monitored in real-time
using wirelessly, low cost, and low power wireless sensor nodes.