Wafer Level Chip Scale Packaging (WLCSP) refers to the technology of packaging an
integrated circuit at wafer level, resulting in a device practically the same size as the
die. While the name implies devices would be packaged the bare die is actually modified
to add environmental protection layers and solder balls that are then used as the
direct connection to the package carrier or substrate. WLCSP technology allow
devices to be integrated in the design using the smallest possible form factor. WLCSP
devices require no additional process steps on surface mount assembly lines.