During the 22 weeks industrial attachment, the author worked with the
mechanical Simulation Team of UTAC to conduct several mechanical projects.
This report gives a summarized introduction of UTAC Company and R&D
department that the author was assigned to. The author had learned basic
knowledge about IC packaging and assembly, as well as theoretical knowledge
behind several board level reliability tests. This report illustrates the above
background theory. The author was tasked to do several company projects on
mechanical board reliability test such as drop, monotonic and temperature
cycling on board tests. This report gives the detailed description and results of
some projects done by the author. Analysis of results and failure analysis were
provided according to the author’s own opinions of mechanical board level
reliability in relation to material properties and behavior. Lastly, reflection of this
internship is provided to summarize what the author has learnt through IA.