Here, an Alcatel SCR850 is used for the deposition
of sputtered metal layers. This is an RF sputter tool with
six targets and two RF generators. It has the capability of
cosputtering, i. e. the operation of two targets at the same
time. The substrates are placed on a table rotating
underneath the targets. In principal, very thin layers of the
two target materials are deposited alternately. The
theoretical thickness of each layer with the chosen sputter
parameters is in the range of one nanometer. In practice,
surface mobility and diffusion leads directly to the
formation of the alloy with very fine grains.