A simple chip-to-ch hesive bonded ribbons loss problem of wire millimeterwave assemblies.
design and fabrication static model is developed their electrical behavior.
on microstrip resonators The chip-to-chip inter bonded ribbons exhibit GHz or more.
Abstract
p interconnect technique with ad-is presented.
It solves the insertion hond interconnects in micro- and The following paper discusses of such interconnects. A quasi - to ease the quality assessment of It is validated by measurements with and without interconnects.
sonnect technique with adhesive low loss and is useable up to 50