11.2.1. Contamination
Contamination of the assembly is defined as: any foreign material on the surface of the assembly that is visible in range 8x-10x magnification. Contamination in all forms is to be rejected. Additional guidelines are shown as following:
11.2.1.1. Acceptable if number of loose fiber regardless of size is not more than 3 pieces per assembly.
11.2.1.2. Acceptable if Stains or discoloration on the assembly, which are not soluble in DI water.
11.2.1.3. Airborne particles that are removable with 15 PSI air blow or dry foam swab such as lint, dust is acceptable.
11.2.1.4. No loose particles such as lapping or bonding compound, flaky epoxy, epoxy stringers, loose burrs and foreign particles allowed on the HSA
11.2.1.5. Acceptable if firmly attached contaminants such as solvents or water spots, embedded particles such as solder splash, solder balls, droplets of epoxy, grease, and fingerprints. Oil or any substance present that is not inherent to the design of product.