The thermal conductivity of BN particle/epoxy composite systems was investigated in order to identify the optimal
amount of an aminosilane compatibilizer. The aminosilane
coupling agent was expected to reduce the gap between the
polymer and the surface of the BN filler, thereby improving the thermal conductivity of the composite material. If
the thickness of the silane layer was in excess of a certain
value, the thermal conductivity of the composite material
decreased, due to the thermal resistance of the silane layer.
The specific surface area was converted into the shape factor using the filler size and thickness, and the shape factor
successfully represented the maximum thermal conductivity of the composite systems