A typical cross-section obtained through this process is shown in Fig. 1.
The deep n-well doping profile is one of the most important characteristics involved in the design of the HV modified structures proposed in this paper. N-well surface concentration and depth depend on process scale and substrate concentration. The inclusion of this layer in the drain of the proposed HV structures will be responsible for the device blocking voltage increase, due to its lightly doped concentration in comparison with the standard MOS n implants. It will also be shown that the p-type field