This nanoimprint module is primarily intended for a research-and-development environment or for low-volume production. It uses a UV-curable process with a double layer of spin-coated resists.3 The mold is based on a standard 5in mask-blank platform and the field size is 1in(×)1 in. Gas pressure is applied to the back of the wafer to make the imprint pressure uniform, and a vacuum applied between the mask and the substrate eliminates air trapping.