Recently, another standard - spearheaded by the
Automotive Electronic Council (AEC) - Method 011, is
introduced in the semiconductor industry. But its scope is
generally centered only for those in the manufacturng of
automotive grade integrated circuits and sensor devices.
Basically, the shearing procedure and set-up under these
two (2) aforementioned standards are the same. However,
AEC focuses on ball diameter dimension to define the
required shear strength. It has a distinct prerequisite
where a particular ball size reguired a minimum individual
and average shear values. It does not speclfy a particular
window of ball diameter ranges per wire size in contrast
with ASTM which requires 2.5 to 5 . 0 ~wi re diameter.