A summary of results for our NDT-module solution are shown in Table 1, which draws a comparison between
our ultrasound-based measured results using low power MSP430 solution, and the actual thickness of the steel and
tungsten layer. The error percentage is due to the finite resolution of the MCU’s CC module, which operates at a
maximum clock speed of 32MHz, or 31.25Șs per clock tick. Increasing the resolution of the CC would require a
different MCU with higher maximum clock speeds, which comes at the cost of increased power consumption.