Top-Down. In the top-down approach, thin films or
bulk materials are scaled down to create nanodevices. this
can be done by using various techniques such as precision
engineering and lithography and has been developed and
re,ned by the semiconductor industry over the past $" years.
Indeed, the never-ending race towards miniaturization of
devices (mobile, camera, etc.) induced an intense research in
themanufacturing processes of the basic components of these
devices. Subtractive and additive transfers lead to di-erent
nanoarchitectured materials