The TS24h of MDI4-bonded sunflower particleboards were close to those bonded with UF (Fig. 8).
Further, the higher MDI dosage resulted in a significantly reduced TS24h for the sunflower particleboard.
Reduced TS24h was also seen for the particleboards made from spruce and cup-plant, respectively, all bonded with the higher MDI dosage.
For UF-bonded particleboards the higher resin content significantly reduced TS24h of spruce as well as cup-plant particleboard.
The TS24h of topinambour and sunflower particleboards did not show significant differences when the higher dosage of UF resin was used.