Thermal resistance, junction to solder point °C/W 2.5
viewing angle (FWHM) degrees 125
Temperature coefficient of voltage mv/°C -2
eSD withstand voltage (HBM per Mil-Std-883D) v 8000
DC forward current mA 3000
Reverse voltage v -5
Forward voltage (@ 1050 mA, 85 °C) v 2.95 3.25
LeD junction temperature °C 150