Carbon fiber is an emerging material in electrical and electronics industry. It has
been used as contact in many applications, such as switch, potentiometer, and
commutator brush. A new technique of electronics interconnect is developed, with carbon
fiber as a conductive medium. This carbon fiber interconnect can provide interconnection
between two planes in different levels of electronics packaging, from semiconductor die,
substrate, packaged component to printed circuit board. For example, it can provide a
separable interconnect between a land grid array (LGA) or ball grid array (BGA) IC
package to a printed circuit board, as an LGA or BGA socket. The interconnect device
consists of an array of contact pins. Each contact pin consists of a large number of carbon
fibers which can act cooperatively to provide a high degree of reliability and
predictability to the interconnect function. A nickel coating can be applied over carbon
fibers to enhance its conductivity and solderability. Analytical evaluations and
experimental mechanical and electrical characterizations have been conducted to
conclude that the carbon fiber interconnect is a promising interconnect technique.
Carbon fiber is an emerging material in electrical and electronics industry. It hasbeen used as contact in many applications, such as switch, potentiometer, andcommutator brush. A new technique of electronics interconnect is developed, with carbonfiber as a conductive medium. This carbon fiber interconnect can provide interconnectionbetween two planes in different levels of electronics packaging, from semiconductor die,substrate, packaged component to printed circuit board. For example, it can provide aseparable interconnect between a land grid array (LGA) or ball grid array (BGA) ICpackage to a printed circuit board, as an LGA or BGA socket. The interconnect deviceconsists of an array of contact pins. Each contact pin consists of a large number of carbonfibers which can act cooperatively to provide a high degree of reliability andpredictability to the interconnect function. A nickel coating can be applied over carbon fibers to enhance its conductivity and solderability. Analytical evaluations andexperimental mechanical and electrical characterizations have been conducted toconclude that the carbon fiber interconnect is a promising interconnect technique.
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