Show the evolution of resistivity as a function of total pressure of TiC films deposited using both of Ti pure target and Tic target. The electrical resistivity of TiC films deposited using Tic target (without biasing substrate) increases 3480.3 µ Ω cm at 16 mTorr to 32,474 * 〖10〗^3 µ Ω cm at 40 mTorr. At high pressure, the films proved to be non-conductive with the values of 〖10〗^7 µΩ cm. At low pressure (16mTorr), the film resistivity dropped sharply, and have semiconductor behavior. The electrical resistivity of TiC films deposited using Ti target reaches a value of 70 µΩ cm at low pressure (4mTorr) and have a conductor behavior. With the increase of pressure, films resistivity also increases and achieves 1000 µΩ cm at 100 mTorr which have a semiconductor behavior. The resistivity increases with the rise of pressure. The increases of the resistivity as a function of the pressure is due to the presence of C-H bond resulting from the using of CH_4 as reactive gas, as describe in our previous work. Indeed, the disordered amorphous carbon phase has not been revealed by Raman spectroscopy but in our previous work the C-H bond has well been revealed by Fourier Transform Infrared spectroscopy FTIR.