In this study, copper foam fabricated using the electroforming
technique was employed as the heat-sinking
material. Because of the special flow characteristic of fluid
flow in the copper foam and enlarged heat transfer area, the
copper foam heat sink has better performance as compared
with those of single-channel, plate-fin and pin-fin heat
sinks. The measured results also indicated that the thermal
resistance of copper-foam heat sink decreases with the
decrease in porosity which can be controlled by the electroforming
time.