Atomic layer deposition (ALD) is a promising deposition tech- nique in manufacturing conformal inorganic material layers with precise thickness control down to the nanometer scale [1]. It has the capability to deposit highly uniform and conformal thin films on extremely complex shape surfaces [2]. A typical ALD process operates in a sealed reactor chamber, and exposes the substrate surface to precursor gases in alternate pulses, where purging pro- cess is performed between these pulses to effectively avoid the reactions between precursors in the gas phase. By this means, the substrate surface can be saturated with precursor fragments at the end of each pulse, and take surface reactions in sequence. Eventually, a film is produced on the substrate surface and its thickness can be controlled in atomic level by repeatable ALD