ing 28 mm=6 mm thickness 1.0 mm . The sensor con- Ž .
tact pads were electrically bonded by ultrasonic wiring to
aluminum conducting paths which were photolithographically
patterned on the ceramic support. After wiring, the
contact pads and wires were encapsulated with epoxy
resin. Details about the construction and operation of the
ISFETs can be found in Ref