The electroforming process is performed at room
temperature and the copper sulfite is used as the electrolyte.
During the electroforming, the electrolyte is stirred by air
in order to have uniform electroforming inside the coated
polymer foam. The electroforming thickness is controlled
by the applied electric current density and time duration.
To prevent failure during the electroforming process, low
current density of 600 mA/cm2 is employed. By controlling
the electroforming time duration, it is able to obtain
the copper foam with various porosities. In this study, nine
different copper foams are fabricated and shown in Fig. 3b.
As shown in Fig. 3b, for PPI = 10, 20 and 40, copper
foams with porosity e in the range of 0.595–0.868 are
fabricated. The following procedures were used to estimate
the porosity range indicated above. We first compute
the bulk volume of the polymer foam denoted as Vbulk from
the bulk dimension of the foam. By immersing the polymer
foam into a measuring cup filled with water volume of
Vbulk, total volume of water will increase due to the polymer
fiber. This increased volume is the fiber volume of the
polymer denoted as Vfiber. The void volume and porosity
of the polymer foam can then be computed as Vvoid =
Vbulk - Vfiber and ep = Vvoid/Vbulk, respectively. For the
copper foam, we neglect the volume and weight of seeded
silver layer since its thickness is small
The electroforming process is performed at room
temperature and the copper sulfite is used as the electrolyte.
During the electroforming, the electrolyte is stirred by air
in order to have uniform electroforming inside the coated
polymer foam. The electroforming thickness is controlled
by the applied electric current density and time duration.
To prevent failure during the electroforming process, low
current density of 600 mA/cm2 is employed. By controlling
the electroforming time duration, it is able to obtain
the copper foam with various porosities. In this study, nine
different copper foams are fabricated and shown in Fig. 3b.
As shown in Fig. 3b, for PPI = 10, 20 and 40, copper
foams with porosity e in the range of 0.595–0.868 are
fabricated. The following procedures were used to estimate
the porosity range indicated above. We first compute
the bulk volume of the polymer foam denoted as Vbulk from
the bulk dimension of the foam. By immersing the polymer
foam into a measuring cup filled with water volume of
Vbulk, total volume of water will increase due to the polymer
fiber. This increased volume is the fiber volume of the
polymer denoted as Vfiber. The void volume and porosity
of the polymer foam can then be computed as Vvoid =
Vbulk - Vfiber and ep = Vvoid/Vbulk, respectively. For the
copper foam, we neglect the volume and weight of seeded
silver layer since its thickness is small
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