The inductor half shown in Fig. 9(b) was obtained after the
winding half was inserted into the corresponding core half. Two
inductor halves were connected in the center by solder. A small
amount of solder paste SMD291SNL10 was deposited in the
center of the winding halves. The two inductor halves were
placed onto a reflow belt furnace to carry out the solder process
described in [14]. In order to exclude the air between the two
halves as much as possible, an equivalent pressure of 500 lbf/in2
was placed on top of the inductor. The prototype of the assembled inductor is shown in Fig. 9(c).