Cu particles as the bonding phase only exhibit deformation. With the extension of SFPB-treated time, the surface shape variables also will increase. CuW70 is a composite material made of two phases of body centered cubic tungsten and face-centered cubic copper, which have no solubility and no interphase between them. Therefore, the two phases are non -reaction wetting, namely incomplete wetting. However, the bonding phase copper evenly distributed around the skeleton phase tungsten, as seen in Fig. 1, which stating that they are complete wetting. This phenomenon result from several reasons, firstly, the supersonic particle bombardment make the grain refinement, then increase the surface energy of grain boundary, further improving the surface energy of solid phase (the W phase) and improving the wetting property between tungsten and copper. Second, the little surface activation elements are added to improve the solubility of two phases when infiltrated, further improving their wetting property [8]. Thirdly, higher sintering temperatures also help to improve the wetting property of tungsten-copper. The complete wetting of grain boundaries by the melt make the distribution of copper between tungsten nanograins changed in the surface layer.