molten ball when it was required to

molten ball when it was required to thermosonically bonded onto the IC pad. As the dimension of the wire and the ball are
in the range of less than 50 microns, conventional hardness testers like Rockwell, Brinell and even normal Vickers cannot
be used due to the respective size of indenter or the load used. With the size of a bonding wire in micron range, the load
required to measure the hardness has to reduce significantly in the range of less than 50 gram force and a hardness tester of
specially capability to apply load in such a range is necessary