Provide/trade with top tier suppliers in order to bring a complementary set of materials, components and equipment i.e. Glastic solder pallet, Ohashi bonding machine, Anisotropic Conductive Filem (ACF), Heat Seal Connectors (HSCs) and Flexible Printed Circuits (FPCs) to electronic & semiconductor industry then use process knowledge to combine these items in to advance production lines that offer excellent performance and flexibility.