Three-dimensional integrated circui

Three-dimensional integrated circuits (3D ICs) [13], [14] are attractive options for overcoming the barriers in interconnect scaling, thereby offering an opportunity to continue performance improvements using CMOS technology. 3D integration also provides new opportunities for future CMP design, with a new dimension of design space exploration. In particular, the heterogenous integration capability enabled by 3D integration gives designers new perspective when designing future CMPs.